Karyer will participate in Chillventa 2024, showcasing its innovative products.
Chillventa, the top global event for air conditioning, refrigeration, and heat pump technologies, is scheduled to take place in Nuremberg from October 8th to 10th this year. Karyer will participate in the fair to showcase the most recent advancements and innovations in the industry.
As a top company in manufacturing heat exchangers, evaporators, and condensers, Karyer will showcase its products known for their high performance and eco-friendly features. The knowledgeable team from Karyer will be available at booth 8-108 to provide you with comprehensive information on solutions and products tailored to your requirements.
Some products available at Karyer's stand include:
Heat Pump Coil
Heat pumps are efficient and cost-effective devices that run on renewable energy sources, emitting low levels of carbon. Karyer's heat pump coil ensures highly effective heat transfer, leading to energy savings. Its compact design maintains high performance and allows easy integration with different systems.
5 mm Condenser
The 5 mm condenser is designed to work with CO2 refrigerant, taking up minimal installation space due to its compact design. It also needs less refrigerant charging because of its thin tube material and small size. This feature not only saves energy but also materials, making it an eco-friendly choice.
EA Evaporators
EA-DA fruit evaporators are designed for small and medium-sized cold rooms, tailored to meet their refrigeration needs. These evaporators are efficient at small temperature variations and reduce moisture loss. Standard capacities for cold room evaporators range from 2kW to 80kW, with the ability to accommodate larger capacity requirements.
EA Evaporators
The ED Evaporator is a dual-flow air cooler created for challenging situations. It is ideal for industrial cooling needs and features a 630 mm fan. This unit provides versatility by allowing the choice between suction or blowing fans based on the particular requirements of the application.
